You will never discard leftover scraps of pie or pastry dough after you try these cookies. Not only are dough scraps great to have in the freezer for “windfall pies”—little pies that can be made after harvesting a serendipitous discovery of a small amount of berries or other fruit—but when sweetened and flavored, the scraps transform into buttery delicious, crisp cookies. My new spin on these cookies is to flatten them into ovals, which not only makes them larger, it also gives them a more artistic design.
|superfine sugar (see Note)|
|turbinado sugar, preferably Sugar in the Raw||.||.||.|
Two 15 by 12 inch cookie sheets, no preparation needed or lined with parchment
Thirty minutes or longer before baking, set an oven rack in the middle of the oven and
Cut the scraps of dough into similar lengths and lay them on a sheet of plastic wrap, overlapping them slightly. Sprinkle the dough lightly with flour and cover with a second sheet of plastic wrap. Roll lightly to make the dough adhere. Then lift away the top sheet of plastic wrap and use the bottom sheet to help fold the dough into thirds, like a business letter. Wrap the dough well in plastic wrap and refrigerate it while preparing the sugar mixture.
In a small bowl, stir together the superfine sugar and cinnamon until evenly mixed.
Divide the dough into 2 equal pieces. Roll each piece of dough into a narrow
Remove and discard the plastic wrap from 1 cylinder. With a sharp knife, cut the cylinder on a diagonal into 1 inch thick slices. Any gaps will seal on rolling. Roll out each slice into a 2 inch long by 1½ inch wide oval to resemble a rose. For a glimmer of sparkle, lightly sprinkle the tops with the turbinado sugar. Place the cookies on a cookie sheet at least 1 inch apart.
Set the cookie sheet on a wire rack and use a pancake turner to lift the cookies onto another wire rack. Cool completely.
While the first batch of cookies is baking, shape the dough for the second batch.
Airtight: room temperature, 3 weeks; frozen, 6 months.
Copyright © 2014 by Cordon Rose, LLC. Published by Houghton Mifflin Harcourt Publishing Company. All rights reserved.